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? 2003 microchip technology inc. ds21370b-page 1 m TC1232 features ? precision voltage monitor - adjustable +4.5v or +4.75v ? reset pulse width ? 250 msec minimum ? no external components ? adjustable watchdog timer - 150 msec, 600 msec or 1.2 sec ? debounced manual reset input for external override applications ? computers ? controllers ? intelligent instruments ? automotive systems ? critical p power monitoring general description the TC1232 is a fully-integrated processor supervisor that provides three important functions to safeguard processor sanity: precision power on/off reset control, watchdog timer and external reset override. on power-up, the TC1232 holds the processor in the reset state for a minimum of 250 msec after v cc is within tolerance to ensure a stable system start-up. microprocessor sanity is monitored by the on-board watchdog circuit. the microprocessor must provide a periodic low-going signal on the st input. should the processor fail to supply this signal within the selected time-out period (150 msec, 600 msec or 1200 msec), an out-of-control processor is indicated and the TC1232 issues a processor reset as a result. the outputs of the TC1232 are immediately driven active when the pb input is brought low by an external push-button switch or other electronic signal. when connected to a push-button switch, the TC1232 provides contact debounce. the TC1232 is packaged in a space-saving 8-pin pdip or soic package and a 16-pin soic (wide) package and requires no external components. package types 13 12 11 10 9 15 14 18 2 7 3 6 4 5 TC1232 rst rst gnd tol td pb rst rst st v cc rst st 18 27 36 45 rst gnd tol td pb rst rst st v cc pb rst v cc 1 2 3 4 5 6 7 8 16 nc td nc nc tol gnd nc nc nc TC1232 nc nc 16-pin soic wide 8-pin pdip 8-pin soic TC1232 18 36 45 TC1232 microprocessor monitor
TC1232 ds21370b-page 2 ? 2003 microchip technology inc. functional block diagram v cc TC1232 + ? 5%/10% tol era nc e select tol debounce watchdog timebase select pb rst td gnd v ref watchdog timer reset generator rst st + rst + ?
? 2003 microchip technology inc. ds21370b-page 3 TC1232 1.0 electrical characteristics absolute maximum ratings? voltage on any pin (with respect to gnd) ...................................................... -0.3v to +5.8v operating temperature range c-version ........................................ 0c to +70c e-version ..................................... -40c to +85c storage temperature range ............. -65c to +150c ? stresses above those listed under "absolute maximum rat- ings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. expo- sure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, t a = t min to t max ; v cc = +4.5v to 5.5v. parameters sym min typ max units conditions supply voltage v cc 4.5 5.0 5.5 v st and pb rst input high level v ih 2.0 ? v cc +0.3 v note 1 st and pb rst input low level v il -0.3 ? +0.8 v input leakage st , tol i l -1.0 ? +1.0 a output current rst i oh -1.0 -12 ? ma v oh = 2.4v current rst, rst i ol 2.0 10 ? ma v ol = 0.4v operating current i cc ? 50 200 a note 2 v cc 5% trip point v cctp 4.50 4.62 4.74 v tol = gnd (note 3) v cc 10% trip point v cctp 4.25 4.37 4.49 v tol = v cc (note 3) capacitance electrical characteristics: unless otherwise noted, t a = +25c . (note 4) input capacitance st , tol c in ?? 5 pf output capacitance rst, rst c out ?? 7 pf ac electrical characteristics: unless otherwise noted, t a = t min to t max ; v cc = +5v to 10%. pb rst t pb 20 ? ? msec figure 3-3 (note 5) pb rst delay t pbd 1 4 20 msec figure 3-3 reset active time t rst 250 610 1000 msec st pulse width t st 20 ? ? nsec figure 3-4 st time-out period t td 62.5 150 250 msec td pin = 0v, figure 3-4 250 600 1000 msec td pin = open, figure 3-4 500 1200 2000 msec td pin = v cc, figure 3-4 v cc fall time t f 10 ? ? sec figure 3-5 , (note 4) v cc rise time t r 0? ?sec figure 3-6 , (note 4) v cc detect to rst high and rst low t rpd ? ? 100 nsec figure 3-7 , v cc falling v cc detect to rst high and rst open t rpu 250 610 1000 msec figure 3-8 , v cc rising, (note 6) note 1: pb rst is internally pulled up to vcc with an internal impedance of typically 40 k ? . 2: measured with outputs open. 3: all voltages referenced to gnd. 4: ensured by design. 5: pb rst must be held low for a minimum of 20 msec to ensure a reset. 6: t r = 5 sec.
TC1232 ds21370b-page 4 2003 microchip technology inc. 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table pin no. (8-pin pdip, soic) pin no. (16-pin soic) symbol function 1 2 pb rst push-button reset input. a debounced active-low input that ignores pulses less than 1 msec in duration and is ensured to recognize inputs of 20 msec or greater. 2 4 td time delay set. the watchdog time-out select input (t td = 150 msec for td = 0v, t td = 600 msec for td = open, t td = 1.2 sec for td = v cc ). 3 6 tol tolerance input. connect to gnd for 5% tolerance or to v cc for 10% tolerance. 4 8 gnd ground. 5 9 rst reset output (active-high) ? goes active: 1. if v cc falls below the selected reset voltage threshold. 2. if pb rst is forced low. 3. if st is not strobed within the minimum time-out period. 4. during power-up 611 rst reset output (active-low, open-drain) ? see rst. 713 st strobe input. input for watchdog timer. 815v cc the +5v power-supply input. ? 1,3,5,7,10,12,16 nc no internal connection.
? 2003 microchip technology inc. ds21370b-page 5 TC1232 3.0 detailed description 3.1 power monitor the TC1232 provides the function of warning the pro- cessor of a power failure. when v cc is detected as being below the voltage levels defined by the tol pin, the TC1232?s comparator outputs the rst and rst signals to a logic level that warns the system of an out- of-tolerance power supply. the rst and rst signals switch at a threshold value of 4.5v if tol is tied to v cc and at a value of 4.75 volts if tol is grounded. the rst and rst signals are held active for a minimum of 250 msec to ensure that the power supply voltage has been stabilized. 3.2 push-button reset input the debounced manual reset input (pb rst ) manually forces the reset outputs into their active states. once pb rst has been low for a time t pbd (the push-button delay time) the reset outputs go active. the reset outputs remain in their active states for a minimum of 250 msec after pb rst rises above v ih (figure 3-3). a mechanical push-button or active logic signal can drive the pb rst input. the debounced input ignores input pulses less than 1 msec and ecognizes pulses of 20 msec or greater. no external pull-up resistor is required because the pb rst input has an internal pull-up to v cc of approximately 100 a. 3.3 watchdog timer when the st input is not stimulated for a preset time period, the watchdog timer function forces rst and rst signals to the active state. the preset time period is determined by the td inputs to be 150 msec with td connected to ground, 600 msec with td floating, or 1200 msec with td connected to v cc (typical). the watchdog timer starts timing-out from the set time period as soon as rst and rst are inactive. if a high- to-low transition occurs on the st input pin prior to time-out, the watchdog timer is reset and begins to time-out again. if the watchdog timer is allowed to time- out, then the rst and rst signals are driven to the active state for 250 msec minimum (figure 3-2). the software routine that strobes st is critical. the code must be in a section of software that is executed frequently enough so the time between toggles is less than the watchdog time-out period. one common technique controls the p i/o line from two sections of the program. the software might set the i/o line high while operating in the foreground mode and set it low while in the background or interrupt mode. if both modes do not execute correctly, the watchdog timer issues reset pulses. 3.4 supply monitor noise sensitivity the TC1232 is optimized for fast response to negative- going changes in v dd . systems with an inordinate amount of electrical noise on v dd (such as systems using relays) may require a 0.01 f or 0.1 f bypass capacitor to reduce detection sensitivity. this capacitor should be installed as close to the TC1232 as possible to keep the capacitor lead length short. figure 3-1: push-button reset. figure 3-2: watchdog timer. v cc tol pb rst gnd rst st i/o reset +5v TC1232 td micro- processor v cc tol gnd rst st reset +5v TC1232 td 0.1 10 k ? i/o micro- 3-terminal regulator +5v f processor
TC1232 ds21370b-page 6 ? 2003 microchip technology inc. figure 3-3: push-button reset ? pb rst input. figure 3-4: strobe input. figure 3-5: power-down slew rate. figure 3-6: power-up slew rate. rst v il t pb rst t pbd v ih t rst pb rst the debounced pb rst input ignores input pulses less than 1 msec and is designed to recognize pulses of 20 msec or greater. t st st t td note: t td is the maximum elapsed time between st high- to-low transitions (st is activated by falling edges only) which will keep the watchdog timer from forcing the reset outputs active for a time of t rst . i td is a function of the voltage at the td pin, as tabulated below: condition min i td typ max td pin = 0v 62.5 ms 150 ms 250 ms td pin = open 250 ms 600 ms 1000 ms td pin = v cc 500 ms 1200 ms 2000 ms +4.75v t f v cc +4.25v t r v cc +4.25v +4.75v
? 2003 microchip technology inc. ds21370b-page 7 TC1232 figure 3-7: v cc detect reset output delay (power-down). figure 3-8: v cc detect reset output delay (power-up). v cc = 5v +4.5v (5% trip point) +4.25v (10% trip point) rst rst v ol v oh t rpd v cc slew rate = 1.66 mv/sec (0.5v/300 sec) v cc 4.6v (5% trip point) 4.5v(10% trip point) rst rst v ol v oh t rpu
TC1232 ds21370b-page 8 ? 2003 microchip technology inc. 4.0 packaging information 4.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn TC1232 i/p256 0351 TC1232 coa0351 256 legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard otp marking consists of microchip part number, year code, week code, and traceability code. 16-lead soic (150 mil) example: xxxxxxxxxxxxx yywwnnn xxxxxxxxxxxxx TC1232 coe 0351256 xxxxxxxxxx
? 2003 microchip technology inc. ds21370b-page 9 TC1232 8-lead plastic dual in-line (pa) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes : dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
TC1232 ds21370b-page 10 ? 2003 microchip technology inc. 8-lead plastic small outline (oa) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2003 microchip technology inc. ds21370b-page 11 TC1232 16-lead plastic small outline (oe) ? wide, 300 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.33 0.28 0.23 .013 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 10.49 10.30 10.10 .413 .406 .398 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 16 16 n number of pins max nom min max nom min dimension limits millimeters inches* units l c h 45 1 2 d p n b e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-102 significant characteristic
TC1232 ds21370b-page 12 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21370b-page13 TC1232 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. part no. x /xx package temperature range device device: TC1232: microprocessor monitor temperature range: c = 0c to +70c e = -40c to +85c package: pa = plastic dip (300 mil body), 8-lead oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead tape and reel oe = plastic soic (300 mil body), 16-lead oe713 = plastic soic (300 mil body), 16-lead tape and reel examples: a) TC1232coa: 0c to +70c, 8l-soic b) TC1232coa713: 0c to +70c, 8l-soic, tape and reel c) TC1232coe: 0c to +70c, 16l-soic d) TC1232coe713: 0c to +70c, 16l-soic, tape and reel e) TC1232cpa: 0c to +70c, 8l-pdip f) TC1232eoa: -40c to +85c, 8l-soic g) TC1232eoa713: -40c to +85c, 8l-soic, tape and reel h) TC1232eoe: -40c to +85c, 16l-soic i) TC1232eoe713: -40c to +85c, 16l-soic, tape and reel j) TC1232epa: -40c to +85c, 8l-pdip
TC1232 ds21370b-page 14 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21370b - page 15 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. accuron, application maestro, dspic, dspicdem, dspicdem.net, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, picc, pickit, picdem, picdem.net, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that ac t.
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